Theory and Methods of Quantification Design on System-Level Electromagnetic Compatibility

Nonfiction, Science & Nature, Technology, Microwaves, Electronics, Circuits
Cover of the book Theory and Methods of Quantification Design on System-Level Electromagnetic Compatibility by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia ISBN: 9789811336904
Publisher: Springer Singapore Publication: March 5, 2019
Imprint: Springer Language: English
Author: Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
ISBN: 9789811336904
Publisher: Springer Singapore
Publication: March 5, 2019
Imprint: Springer
Language: English

This book systematically explains the fundamentals of system-level electromagnetic compatibility and introduces the basic concept of system-level electromagnetic compatibility quantification design. The topics covered include the critical technologies in the top-down quantification design of electromagnetic compatibility, quantification design of system-level electromagnetic compatibility, evaluation methods and application examples, quality control and application examples of electromagnetic compatibility development process, and real-world engineering example analysis of electromagnetic compatibility.

The book proposes a top-down system-level electromagnetic compatibility quantification design method and is the first book to describe in detail how to quantitatively evaluate and predict system-level electromagnetic compatibility performance. It includes abundant engineering examples and experimental data demonstrating the usage and results of the top-down quantification design methods of system-level electromagnetic compatibility.

It enables readers to obtain a thorough understanding of the theory and methods of system-level electromagnetic compatibility quantification design as well as the methodologies for engineering practice.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book systematically explains the fundamentals of system-level electromagnetic compatibility and introduces the basic concept of system-level electromagnetic compatibility quantification design. The topics covered include the critical technologies in the top-down quantification design of electromagnetic compatibility, quantification design of system-level electromagnetic compatibility, evaluation methods and application examples, quality control and application examples of electromagnetic compatibility development process, and real-world engineering example analysis of electromagnetic compatibility.

The book proposes a top-down system-level electromagnetic compatibility quantification design method and is the first book to describe in detail how to quantitatively evaluate and predict system-level electromagnetic compatibility performance. It includes abundant engineering examples and experimental data demonstrating the usage and results of the top-down quantification design methods of system-level electromagnetic compatibility.

It enables readers to obtain a thorough understanding of the theory and methods of system-level electromagnetic compatibility quantification design as well as the methodologies for engineering practice.

More books from Springer Singapore

Cover of the book Advances in Machine Learning and Data Science by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Basic and Applied Zooplankton Biology by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Information Innovation Technology in Smart Cities by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Supply Management by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Statistics and Scaling in Turbulent Rayleigh-Bénard Convection by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Advanced Computing and Communication Technologies by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Transformations of Social-Ecological Systems by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book International Human Resource Management in South Korean Multinational Enterprises by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Materials Selection and Design by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Chinese International Students’ Stressors and Coping Strategies in the United States by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Quality, IT and Business Operations by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Intelligent Embedded Systems by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Geo-Architecture and Landscape in China’s Geographic and Historic Context by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Playable Cities by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
Cover of the book Green Development in China by Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy