Physical Design for 3D Integrated Circuits
Nonfiction, Science & Nature, Technology, Electronics, Microelectronics, Circuits
| Author: | ISBN: | 9781351830195 | |
| Publisher: | CRC Press | Publication: | December 19, 2017 |
| Imprint: | CRC Press | Language: | English |
| Author: | |
| ISBN: | 9781351830195 |
| Publisher: | CRC Press |
| Publication: | December 19, 2017 |
| Imprint: | CRC Press |
| Language: | English |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.
The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
- Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
- Supplies state-of-the-art solutions for challenges unique to 3D circuit design
- Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.
The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
- Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
- Supplies state-of-the-art solutions for challenges unique to 3D circuit design
- Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
