Heat Pipes
Theory, Design and Applications
Nonfiction, Science & Nature, Technology, Machinery, Science, Physics, Thermodynamics
| Author: | David Reay, Ryan McGlen, Peter Kew | ISBN: | 9780080982793 |
| Publisher: | Elsevier Science | Publication: | October 1, 2013 |
| Imprint: | Butterworth-Heinemann | Language: | English |
| Author: | David Reay, Ryan McGlen, Peter Kew |
| ISBN: | 9780080982793 |
| Publisher: | Elsevier Science |
| Publication: | October 1, 2013 |
| Imprint: | Butterworth-Heinemann |
| Language: | English |
Heat Pipes, 6th Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.
This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time.
- Contains all information required to design and manufacture a heat pipe
- Suitable for use as a professional reference and graduate text
- Revised with greater coverage of key electronic cooling applications
Heat Pipes, 6th Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.
This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time.
- Contains all information required to design and manufacture a heat pipe
- Suitable for use as a professional reference and graduate text
- Revised with greater coverage of key electronic cooling applications
